Modern electronics development depends on accurate insight across electromagnetics, signal and power integrity, thermal behavior, and electromechanical performance. The Ansys Electronics portfolio helps engineering teams design and validate products with greater confidence, reduce testing cost, and improve reliability from component to system level.
From antennas, RF, and microwave systems to PCBs, packages, ICs, electric machines, and EV powertrains, these solutions support a wide range of electronics challenges within one connected simulation environment.


A leading 3D electromagnetic field solver for high-frequency and high-speed electronic design. Ideal for teams developing antennas, RF components, interconnects, and advanced wireless systems.
Design and analyze antennas, antenna arrays, and RF components
Support filters, connectors, interconnects, IC packages, and PCBs
Use FEM, integral equation, asymptotic, and hybrid solver technologies
Improve confidence in advanced RF, microwave, and wireless design workflows

A specialized tool for signal integrity, power integrity, and EMI analysis in PCB and package workflows. Well suited for board-level and package-board studies where power delivery and channel behavior are critical.
Analyze high-speed channels, impedance, crosstalk, and EMI behavior
Support power delivery system studies for boards and packages
Run IBIS and IBIS-AMI SerDes analysis workflows
Automate decoupling capacitor optimization for improved PI performance

A low-frequency electromagnetic field solver for electromechanical devices and power-focused applications. Well suited for engineers working on motors, actuators, sensors, transformers, and wireless charging systems.
Solve static, frequency-domain, and transient electric and magnetic fields
Support electric machines, power converters, and electromechanical devices
Benefit from automatic adaptive meshing for improved accuracy
Extend analysis with multidomain system modeling workflows

An integrated multiphysics design tool for electric motors across the full torque-speed range. Best for teams optimizing motor efficiency, size, thermal behavior, and real operating performance.
Combine electromagnetic, thermal, and mechanical motor analysis
Generate efficiency maps and evaluate duty-cycle performance
Optimize designs across the full operating range
Improve motor development speed with an integrated workflow

A multiscale platform for signal and power integrity analysis across IC-to-system workflows. Especially useful in advanced semiconductor and package development where early insight and signoff accuracy both matter.
Support IC-aware system design and system-aware IC design
Analyze signal and power integrity from chip through package and system
Use HFSS, RaptorX, and Q3D technologies within one workflow
Balance early design exploration with signoff-level analysis needs

A CFD-based thermal management solution built for cooling analysis in electronic products and assemblies. A strong fit for teams that need better airflow, heat transfer, and thermal reliability insight early in design.
Predict airflow, temperature, and heat transfer across electronics systems
Analyze IC packages, PCBs, enclosures, assemblies, and power electronics
Support board-level electrothermal coupling and multiscale workflows
Improve cooling strategies and thermal integrity before hardware testing

A parasitic extraction tool for calculating resistance, inductance, capacitance, and conductance in electronic designs. A foundational choice for teams working on packages, interconnects, and power-focused electronic systems.
Extract frequency-dependent parasitics with strong accuracy
Support power integrity and signal integrity analysis workflows
Use automatic adaptive mesh refinement for efficient modeling
Improve package, interconnect, and power electronics design decisions

A cable EMC modeling solution focused on lightning-induced effects and cable EMI/EMC analysis on large platforms. Especially relevant where certification readiness and cable harness behavior are critical engineering concerns.
Analyze cable EMI and EMC behavior in complex platforms
Study lightning-induced electromagnetic effects with greater confidence
Support cable harness evaluation across regulated industries
Improve EMC readiness earlier in the design and certification process

A 3D simulation solution for charging, discharging, and charge carrier transport behavior. Useful where electrostatic charging directly affects performance, safety, or reliability.
Model charging, discharging, and charge transport in one environment
Support surface and internal charging workflows
Analyze ESD behavior in air and dielectric materials
Improve design understanding where electrostatic effects are critical

An RF filter design and optimization solution for high-frequency communications applications. A strong option for teams developing complex RF filters with faster design exploration and optimization workflows.
Support RF filter design for 5G, mmWave, and related applications
Use AI-driven optimization to accelerate filter development
Benefit from integrated workflows with Ansys HFSS
Evaluate manufacturing variation and yield through Monte Carlo analysis

An automated filter design and synthesis solution for RF, microwave, and digital filter workflows. Well suited for teams that want faster, more straightforward filter development and optimization.
Automate filter synthesis across a broad range of topologies
Speed up RF, microwave, and digital filter design workflows
Use embedded component databases to guide design development
Connect with HFSS for deeper electromagnetic validation when needed

A real-time electromagnetic wave simulation solver API for large-scale radar and wireless environments. Best for advanced EM workflows where speed, scale, and dynamic system behavior matter.
Simulate large-scale radar and wireless systems in real time
Support wideband channel analysis for advanced wireless scenarios
Scale efficiently with GPU-enabled workflows
Enable API-driven automation and synthetic data generation for AI/ML use cases

A cloud-based design and simulation platform for electric vehicle powertrains. Ideal for cross-functional teams exploring powertrain architectures, efficiency, range, and system-level tradeoffs early.
Explore the full EV powertrain with connected component models
Support faster decision-making early in development
Evaluate range, efficiency, and design tradeoffs at system level
Enable collaborative workflows across multiple engineering disciplines
A major strength of the Electronics collection is its range. Ansys brings together high-frequency EM, low-frequency EM, electronics cooling, parasitic extraction, signal integrity, power integrity, cable EMC and electric machine design within one portfolio.
At the center is Ansys Electronics Desktop (AEDT), which provides access to products such as HFSS, Maxwell, Q3D Extractor, SIwave and Icepak with ECAD and MCAD workflows and links to broader Ansys solvers for multiphysics analysis. This makes the collection especially valuable for engineering teams that need to move between board, package, IC, motor, cable and system-level design challenges without relying on disconnected tools.
Design antennas and antenna arrays with better visibility into radiation behavior, placement effects, and RF performance. Support stronger wireless products across communications, ADAS, satellite, and IoT applications.
Develop RF and microwave components with simulation that improves electromagnetic performance earlier in design. Increase confidence across filters, connectors, passive devices, and other high-frequency subsystems.
Analyze high-speed interconnect behavior where losses, coupling, and signal quality affect system performance. Support more reliable electronic products by addressing channel behavior earlier in development.
Evaluate PCB performance across layout, integrity, electrothermal behavior, and thermal management workflows. Reduce downstream issues by understanding board-level behavior earlier in the design cycle.
Support advanced package development with simulation for electromagnetic behavior, parasitics, and integrity challenges. Improve performance across IC packages, multilayer packages, and package-to-system interactions.
Protect signal quality in high-speed channels where losses and interface behavior directly affect reliability. Use simulation to improve transmission performance across boards, packages, and electronic systems.
Strengthen power-delivery performance in dense electronic designs where stability and reliability are tightly linked. Support chip, package, and board workflows with earlier insight into power integrity behavior.
Address EMI and EMC challenges with simulation that helps reduce interference risk across products and platforms. Improve compliance readiness and electromagnetic performance earlier in development.
When electromagnetic, thermal, and integrity issues are discovered too late, development becomes slower, costlier, and harder to control.
Fluid Codes helps engineering teams identify the right Ansys Electronics solutions for their workflows, so they can solve problems earlier, reduce rework, and move toward validation with greater confidence